>    多 晶 硅 块
 
 
   >   多 晶 硅 块
 
 
   >   多 晶 硅 片
     
                  产品规格
 
Geometry: square
Conduction type: p boron doped
Wafer dimension: 125×125mm±0.5mm
Oxygen concentration: <2×10E18atoms/cm 3  
Carbon  concentration: <8×10E17atoms/cm 3  
Resistivity: 0.8-3Ωcm, typically 1Ωcm
Life time: min.2μs
Thickness: 220+/-20μm
TTV: max.40μm
Saw Marks: max.20μm
Squaring Angle : 90°+/- 3.0°
Edge flaw: less than 10mm in length, 1.0mm in width
Chipping: depth ≤1.0 mm, no more than 2 chips allowed in one wafer. “V” shaped chip not permitted.
Surface: as cut and cleaned
 
                  产品规格
 
Geometry: square
Conduction type: p boron doped
Wafer dimension: 156×156mm±0.5mm
Oxygen concentration: <2×10E18atoms/cm 3  
Carbon  concentration: <8×10E17atoms/cm 3  
Resistivity: 0.8-3Ωcm, typically 1Ωcm
Life time: min.2μs
Thickness: 220+/-40μm,
TTV: max.50μm
Saw Marks: max.20μm
Squaring Angle :90°+/- 3.0°
Edge flaw: less than 10mm in length, 1.0mm in width
Chipping: depth ≤1.0 mm, no more than 2 chips allowed in one wafer. “V” shaped chip not permitted.
Surface: as cut and cleaned
 
     
 
电话 : ++86-574-8682-0813  传真 : ++86-574-8688-0129 电子邮件 : office@sipv.com.cn
版权所有:宁波晶元太阳能有限公司   Copyright : Zhejiang Sino-Italian Photovoltaic co.,ltd